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TM4C129XNCZAD: Environmental conditions details required for TI components

Part Number: TM4C129XNCZAD

Hi

I am using multiple components including TM4C129XNCZAD from TI in my design. We have a product requirement to meet operating conditions of up to 90% RH. However I don't see any mention of operating humidity conditions mentioned. MSL level is mentioned for the pre-assembly storage conditions. Where to get the details for operating humidity conditions for these?

  • Presumably you are conformal coating then?

    Robert
  • Thanks Robert for the response. We have not decided to conformal coat the boards yet. Before that I wanted to check TI's recommendations on operating humidity for its devices.
  • Is robust operation - w/in a "high-humidity" environment - (only) achieved via, "electronic component spec?" Might the pcb substrate, trace "length & layout", airflow (deliberate or via convection), solder specification, power dissipation, and "presence of coating" - ALL impact the pcb's performance?

    It is said that, "the chain will fail based upon the failure of the "weakest link." The MCU is but "one" link in that chain - much more investigation is required to discover "where best" to direct (environmental hardening) resources...
  • I'd be concerned about pin to pin conduction and ion conduction from 'no-clean' flux. I would have thought that for high humidity environments conformal coating was de rigueur.

    Robert
  • Robert Adsett72 said:
    I would have thought that for high humidity environments conformal coating was de rigueur. 

    Two share "such thought" - focus (almost) entirely upon semi-conductor "details" - may not prove, "best/brightest."

    As stated - attack may occur "anywhere" upon the circuit board - far more "broad-based" approach is required...