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RM57L843: RTEMS OS Build parameters for RM57L843

Peter Cunningham81904
Prodigy 80 points
Part Number: RM57L843
Other Parts Discussed in Thread: TMS570LS3137

A RTEMS OS build configuration ( -mbig-endian -mthumb -march=armv7-r -mfpu=vfpv3-d16 -mfloat-abi=hard )  was published in the RTEMS wiki for board support packages ( devel.rtems.org/wiki/TBR/BSP/Tms570 ) for the Hercules TMS570LS3137, which is a ARM CORTEX-R4F (big endian) lock step processor.  Does the same RTEMS OS Build configuration apply to the Hercules RM57L843 which is based on the ARM CORTEX-R5F (big endian) lock step processor.  I would expect minor changes in the board support package design but I need assurance that the instruction set is consistent between the 2 processors so the RTEMS build configuration is correct.

Regards,

Pete Cunningham

Astrobotic

  • 0
    TI__Guru 59540 points
    Peter,

    The RM57 is a cache based architecture so I would expect that there will be significant changes to how it would be configured due to the different memory model/map. Also, the TMS570 devices are BE and the RM4x and RM5x devices are LE. Again, I suspect the endianess would also impact the configuration models as well.