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TM4C1294NCZAD: Re-Balling and testing the 212 BGA package.

Part Number: TM4C1294NCZAD

we use the TIVA TMC1294 with the 212 BGA package in our product. I have a large stack of failed board from our manufacturing that I need to test and salvage the processors from. I was wondering if I could find a ZIF socket tester or something along those lines for that chip. And a good way to re-ball them..I have done a lot of internet search and not found anything for the 212 BGA pacakge...

  • There is a (most) qualified "Assembly House" - not far from our Chicago office - which I believe "able" to meet your requirement.    (Firm/I - like you - are "outsiders" here)

    I believe that "real expertise" in the "BGA device Removal, then prep, then test and (finally) in the board restore and BGA replacement" tasks - maximize your "odds of success."     It is suspected that proper X-Ray Inspection - of the (still installed) BGA devices - may prove most useful.       (I (reasonably) advise AGAINST your employing the (assumed) past assembly house - to make such (further) probings...)

    I'm personally unaware of your sought 212 BGA, ZIF socket tester.    It may pay for you to inquire of the "major" Taiwan-based - semi houses.    (Staff/I've seen many such testers - while visiting - although I had NOT keyed upon your specific requirement.)

  • Hi Jerry,

    There are a few good Utube videos of fellows re-balling MCU, made custom hot air jig using thermal couple probes to monitor reflow peak. Tenma makes low cost 2 channel standalone temperature monitor that can input temperature data to computer USB port thermal client. It would seem most videos tend to show MCU insertion not removal.

    The tough part BGA removal perhaps require other steps such a slow pre-heat, required to stop MCU silicon damage in the process. There are several assembly houses in US one being Advanced may be able to help or give some advice.

    www.4pcb.com/pcb-capabilities.html