This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TMS570LS0432: Temperature limitations

Expert 1995 points
Part Number: TMS570LS0432


Hello,

The datasheet of the TMS570LS0432 indicates a minimum temperature of -40°C. Well, I am not an expert of reliability of embedded electronics but I would like to know more about how the MCU was tested at that temperature and which was the criteria for the test.

  • Hi Marco,

    Environmental testing is part of the product testing which is conducted to determine a component’s ability to perform during, or after exposure to a specific environment. Temperature cycling testing, and power cycling testing are part of the product tests.

    Temperature cycling is performed in chambers that control number of cycles, dwell times, ramp rates, and temperature extremes.
  • Clear. Which function(s) are monitored during such a test ? Simply the start up? I wonder what the MCU does inside the chamber in the meanwhile.
  • Hi Marco,

    I mean the temperature cycling test is conducted in a chamber.

    There are three temperature sensors that can be used to read the internal junction temperature on this device. The temperature sensors are connected to the ADC converter.

    The following appnot shows how to use those internal sensors:
    www.ti.com/.../spna216.pdf
  • Hi QJ,

    There is something that I do not get: the MCU is acquiring (by ADC) its own junction temperature into the climatic chamber during the test, isn't it ? If yes, how can you rely on the measurement got by the MCU (due to the temperature the ADC as well as other parts of the MCU may fail) is the "real" -40°C, for example ?

    Regards,

  • Hello Marco,

    Sorry for my confused messages:
    1. Chamber is used to do temperature cycling test during TI silicon product test. We test the silicon performance at different temperatures between -40C to 125C.

    2. The built-in sensors are used by the users to check the junction temperature.