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TM4C1294NCPDT: Difference between TM4C1294NCPDTT3 and TM4C1294NCPDTI3

Takashi Onawa
Genius 13200 points
Part Number: TM4C1294NCPDT

Hi Team,

Could you tell me the difference between TM4C1294NCPDTT3 and TM4C1294NCPDTI3?

My customer want to refer our TI design used TM4C1294NCPDTT3  in it but TM4C1294NCPDTT3 sample is not available on TI.com

Regards,

Takashi Onawa

  • 0
    TI__Guru*** 135355 points

    Hello Onawa-san,

    The TM4C1294NCPDTT3 is for a higher temperature range of -40 to 105 deg C. The TM4C1294NCPDTI3 is for a temperature range of -40 to 85 deg C. If the application will never need the higher temperature range for the MCU, then the customer should consider to use the TM4C1294NCPDTI3 as it is cheaper.

  • 0 in reply to Ralph Jacobi
    TI__Genius 13200 points

    Hi Ralph-san,

    Thanks for you quick response on this.

    OK, I understood the difference. Let me ask one quick confirmation just in case.

    They are P2P compatible, right?

    Regards,

    Takashi Onawa

  • 0 in reply to Takashi Onawa
    TI__Guru*** 135355 points

    Hello Onawa-san,

    Yes they are P2P identical. The only difference is the testing that is done during the manufacturing process to ensure full device functionality at the higher temperature range.

  • 0 in reply to Ralph Jacobi
    Guru 117855 points

    Greetings Ralph,

    May it be asked,  "Is there a  'notable difference'  in the manufacturing process - which enables the 'TT3' device to 'meet'  that higher temperature standard?

    It is believed that such differentiation may be made via 'testing' - rather than by, 'tighter manufacturing controls and/or enhanced materials.'     (Classification via 'test'  was the (near) usual practice @ multiple Semi-firms - when last we inquired...)

  • 0 in reply to cb1_mobile
    TI__Guru*** 135355 points

    Hi cb1,

    cb1_mobile said:
    It is believed that such differentiation may be made via 'testing' - rather than by, 'tighter manufacturing controls and/or enhanced materials.'

    As far as I am aware, it's really just that, the devices are made the same but the 105 degree devices pass more stringent testing so that we have full confidence in spec'ing them to reliably work up to 105 degree C. If there is something different in the process, I'm not aware of it at my seat located far from our fabs. :)

    I'm not a designer or manufacturer, but I'd imagine the key difference between a 105 vs 85 degree device ends up having to do with the quality of the junctions on the individual devices when fabricated to allow for reliable operation even at higher temperatures that stress the material properties more.

  • 0 in reply to Ralph Jacobi
    Guru 117855 points

    Hi Ralph,

    Thank you - appreciated - several of the 'college student staff' have authored papers - and found, "Just as you have noted!"

    Perhaps of interest - sometimes:

    • different 'wafer runs'
    • or (even) 'location w/in the wafer'

    reveal  'unexpected'  test qualifications.    (both good & bad)

    The degree of excellence w/in chip production insures that (few) here must worry about,  "Devices built (late) on a Friday - or just prior - to a 'long' weekend!"

    [edit]  Staff notes that w/'Exploding Growth of  Artificial Intelligence' - even the, 'ALL-Robot  Wafer Processing Team' - may  'relax' ... just prior to a 'long celebratory weekend!'      Perhaps worse ... as these 'AI' robots develop a 'Taste for Beer'  (beats the hell out of '20 weight synthetic') - and (autonomously) 'Rule the roads' -  passenger 'crash-suits' may become 'necessary & standard issue'  - w/each autonomous car...