RM57L843: MCU Underfill

Mark Philip Felipe

Part Number: RM57L843

Hi Team, I would like to seek help if we can provided such information. Our customer is using the RM57L843 and wants to add an underfill. He is asking if Zymet X2825-B is okay to use, or are there alternatives.

Thank you in advance.

over 6 years ago

0 Sunil Oak over 6 years ago

TI__Mastermind 49120 points

Hi Mark,

I will have to talk to a packaging / thermal management expert and get back to you.

Regards, Sunil

0 Sunil Oak over 6 years ago

TI__Mastermind 49120 points

Hi Mark,

RM57L843 is only available in a 337BGA package. BGAs are usually much better at dissipating heat, and there should really be no need for an underfill.

I cannot provide a better response to this question as I am not familiar with underfills and the specific materials used.

Regards, Sunil

Arm-based microcontrollers

Arm-based microcontrollers forum

RM57L843: MCU Underfill