This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TMS570LC4357: Radiation tolerance data & BSP questions

Part Number: TMS570LC4357
Other Parts Discussed in Thread: HALCOGEN, , , LAUNCHXL2-570LC43

I am evaluating various Hercules platforms for use in a radiation environment, and had a number of basic questions:

- In choosing between the RM57 and TMS570 architectures, beside the temperature rating differences, what internal process variation exists to inform a decision as to which product line is better aligned for a radiation environment? Ideally, I'd like to stick to the RM57 since those are little-endian processors which would make software development and third-party code integration a bit easier; that being said, if there's a compelling reason to go for the TMS570 lineup for SEL tolerance reasons I would like to get some data for this.

- For any of the Hercules line of processors (focusing on RM57/TMS570), does TI have TID/SEL data that can be made available, possibly under NDA? If so, who is the point of contact to get this process started?

- Is there a basic BSP codebase that can be used without having to generate code using HALCogen? At the very least, is there a core set of register maps and peripheral memory maps TI can provide to facilitate software development without having to use a code generator?

  • Hello,

    See my comments inline:

    - In choosing between the RM57 and TMS570 architectures, beside the temperature rating differences, what internal process variation exists to inform a decision as to which product line is better aligned for a radiation environment? Ideally, I'd like to stick to the RM57 since those are little-endian processors which would make software development and third-party code integration a bit easier; that being said, if there's a compelling reason to go for the TMS570 lineup for SEL tolerance reasons I would like to get some data for this.

    >> RM57x parts are not AEC Q100 qualified while the TMS570LC43x parts are AEC Q100 grade 1 qualified. Both these parts are developed in the same process technology, so I would expect them to perform the same in a radiation environment. They also have the same safety mechanisms and diagnostic features.

    - For any of the Hercules line of processors (focusing on RM57/TMS570), does TI have TID/SEL data that can be made available, possibly under NDA? If so, who is the point of contact to get this process started?

    >> We don't have any radiation data (SEL/SEU) at this time.

    - Is there a basic BSP codebase that can be used without having to generate code using HALCogen? At the very least, is there a core set of register maps and peripheral memory maps TI can provide to facilitate software development without having to use a code generator?

    >> You can use HALCoGen to generate the peripheral drivers' header files. You don't have to use the C source code generated by HALCoGen and write your own routines, using the HALCoGen-generated routines as references. The register maps are described in the technical reference manual. Code Composer Studio also includes a register map for all peripherals as .xml files. It uses these files to show the register contents in the "Registers" window.
  • Thanks a lot for that detailed reply!

    I actually ended up digging up SPNK005:

    for the TMS570LC4357-EP device from TI's site, and it appears there is at least high-level radiation (both LET and TID) test data on that document. I was wondering if a more detailed report (at least providing some visibility into test conditions, types of radiation utilized and package degradation data) is available offline.

    Thanks for the help!

  • Hello,

    As per TI quality guidelines, radiation test data cannot be provided for any part not qualified for use in space applications. These parts have a special designation ("SEP" for Space EP) that indicates suitability for use in Space applications. We can only provide radiation test data for SEP parts.

    That said, we are currently studying the feasibility of releasing a SEP version of TMS570LC4357, and will provide an update at a later date.

  • Okay, thank you for your help. Is it fair to say the LAUNCHXL2-570LC43 is an identical (from a software compatibility) development platform for the TMS570LC4357-EP variant? I am assuming the two parts art functionally identical, and only differ in packaging and environmental compatibility and screening.

  • If you'd like to discuss the testing details offline, feel free to PM me. Would be happy to provide further details on what I'm looking for. I was going off the post made by another user on this forum (I can share the link offline if you want a reference), and assuming this data can be made available if a waiver/NDA is processed. Thanks.

  • Yes, you can use LAUNCHXL2-570LC43 for developing applications targeting TMS570LC4357-EP.

    The parts differ in terms of package construction, test screening, etc. though are functionally equivalent from an application software perspective.

    As for the radiation test data, we cannot share this data with anyone until we have the part qualified as "Space EP".