Other Parts Discussed in Thread: HALCOGEN, , , LAUNCHXL2-570LC43
I am evaluating various Hercules platforms for use in a radiation environment, and had a number of basic questions:
- In choosing between the RM57 and TMS570 architectures, beside the temperature rating differences, what internal process variation exists to inform a decision as to which product line is better aligned for a radiation environment? Ideally, I'd like to stick to the RM57 since those are little-endian processors which would make software development and third-party code integration a bit easier; that being said, if there's a compelling reason to go for the TMS570 lineup for SEL tolerance reasons I would like to get some data for this.
- For any of the Hercules line of processors (focusing on RM57/TMS570), does TI have TID/SEL data that can be made available, possibly under NDA? If so, who is the point of contact to get this process started?
- Is there a basic BSP codebase that can be used without having to generate code using HALCogen? At the very least, is there a core set of register maps and peripheral memory maps TI can provide to facilitate software development without having to use a code generator?