Hi,
My customer wants to do varnish treatment for moisture exclusion and isolation.
Is there any problems or limitations to cover TMS570LC4357 after the device is soldered on PCB?
Thanks and regards,
Koichiro Tashiro
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Hi,
My customer wants to do varnish treatment for moisture exclusion and isolation.
Is there any problems or limitations to cover TMS570LC4357 after the device is soldered on PCB?
Thanks and regards,
Koichiro Tashiro
We are aware that some of our customers put chemical overcoating on our devices after PCB assembly for such reasons but as as a semiconductor vendor, we do not evaluate those materials. As such we do not have a recommendation either way on using or not using such a material in your system.
One good source for overviewing the pros and cons of different materials can be found under this webinar. https://www.dfrsolutions.com/resources/guarantee_reliability_coating_potting-webinar-lp It also has a pdf that you can download.
I think I posted the wrong link. This is the one I intended to post. https://www.dfrsolutions.com/hubfs/Resources/services/Coatings-and-Pottings-Issues-Challenges-and-Consortium.pdf