TMS320F2812: Followup Reflow Question

Lawrence Wong

Part Number: TMS320F2812

Tool/software:

Followup to https://e2e.ti.com/support/microcontrollers/c2000-microcontrollers-group/c2000/f/c2000-microcontrollers-forum/1515277/tms320f2812-reflow-profile-question

Customer want to have more conversation on increasing reflow temperature for GBB suffix part (has tin-lead balls (SNPB)).

They have a board with mix of leaded and lead-free components. Because of some recent design changes they need to increase PCBA reflow max temperature to around 235C.

As you mentioned earlier both ICs GBB (Leaded) and ZAY (Lead-free) uses same dies. Therefore, my understanding is if we increase temp for GBB then it will not impact die and die could withstand with the 235C. Please confirm. (Also, correct me if I am missing something here).

Then I think tin-lead balls from GBB are the only limiting factor to increase reflow temperature.

What will be the impact/ RISK we want to understand on GBB part if they increase max reflow temperature to 235 C?

8 months ago

0 Benjamin Collier 8 months ago

TI__Mastermind 36526 points

Hi,

I will need a few days to look into this.

Best Regards,

Ben Collier

0 Lawrence Wong 8 months ago in reply to Benjamin Collier

TI__Genius 16330 points

Hi Ben,

Any feedback on this?

Regards,

Lawrence

0 Benjamin Collier 8 months ago in reply to Lawrence Wong

TI__Mastermind 36526 points

Sorry, I will try to get an answer tomorrow.

0 Allan Webber 8 months ago

TI__Intellectual 1750 points

The package bill of materials for the GBB should be able to withstand 235C peak reflow temperatures. It would also not require any change to the MSL3 rating.

However, I cannot answer to the solder ball and it's intermetallic post board mount as it will also depend on an interaction with other factors in your board and assembly.

0 Lawrence Wong 8 months ago in reply to Allan Webber

TI__Genius 16330 points

Hi Allan,

Thanks. Feedback from the customer:

==========

Good to know that the package will not have issue if we reflow IC at 235C.

But, if we do not have enough information that BGA balls could accept the 235C temp or not, then we can not update reflow profile.

I am good to share more information if you need to confirm the impact of 235C on the IC.

We are using leaded solder paste and let us know what kind of more information you would need to confirm impact. I’ll see if I can share all needed info with you.

===========

Regards,

Lawrence

0 Allan Webber 8 months ago in reply to Lawrence Wong

TI__Intellectual 1750 points

The package itself is capable of going to 260C as it is the same a the leadfree device. What I am saying about the solder IMC is that I have no guidance to give you on a reflow profile ramp up/cool down etc with a 235C peak reflow to achieve an optimal connection. We can only qualify a component that it can survive such a reflow profile.

IPC/JEDEC J-STD-020F table has a reference for Eutectic and leadfree reflow profiles. The Eutectic profile is much less of a mechanical shock than the leadfree profile.

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TMS320F2812: Followup Reflow Question