MSP430F2619S-HT: Bonding reference guide

Hi,

What do you mean about bonding reference guide?

soldering or PCB layout? 

What's your purpose?

Eason

Hi Eason,

Soldering and PCB layout both needed.

Customer wants to integrate several die for packaging and also need layout guide for IC surrounding.

But soldering guide is most important things.

I'm wondering if there is reference guide documents like this "MicroStar BGA Packaging Reference Guide" (ti.com)?

Thanks.

Hi,

1. So KGD is WB Die, not WCSP Die which need no package and can directly be soldered on the PCB like a BGA.

2. For WB Die, you can put it with any packaging as you want.

3. I think customer want to directly bound the die to PCB directly? Is it right? If so, I would advise customer to consult their bound supplier to know the parameters and the bounding advices.

Eason

Hi Eason,

Yes, customer want to bound the die to PCB directly, he also need the bonding pad definition to soldering to PCB substrate, just like pin definition.

I think customer need to consult their bounding supplier to know the parameters and the bounding advices.

For pad definition, they can find it in the datasheet.