MSP430F2617: Die identification code

Peter Aigner

Part Number: MSP430F2617

We have an MSP430F2617 (with die rev F) marked on the outside of the BGA package. Where can I find information on what the expected part code etched into the silicon die is? We are reading (by microscopy) a die identification of "MSP430F2619F". We are speculating that the dies are configured post manufacture to reflect the actual device in the family (in a similar way that the JTAG part ID read-back for the F261x and F241x is the same ID number).

Thanks,

Peter

over 3 years ago

0 Xiaodong LI over 3 years ago

TI__Mastermind 23295 points

Hi Peter

>> We are reading (by microscopy) a die identification of "MSP430F2619F"

May I know if you mean you have decap MSP430F2619F device?

Thanks!

0 Peter Aigner over 3 years ago

Prodigy 20 points

Hi Xiaodong, yes, the device has been decapped.

Externally the device is (was) marked:

M430F2617T

05A4F9T F

Internally the silicon die is marked

MSP430

F2619F

We know that all F261x electronically read with the same electronic ID (retrievable via JTAG - ID = 0x6FF2). We are wondering if the same applies to the silicon die, i.e. all silicon dies in the F261x family are all marked as F2619?

0 Xiaodong LI over 3 years ago in reply to Peter Aigner

TI__Mastermind 23295 points

Hi Peter

There is no device ID on TLV on MSP430F2617 DS.

I will check your question with the expert and reply to you later

Thanks

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MSP430F2617: Die identification code