I'm trying to design the MSP430F2619S-HT into a project where the device will need to run at its rated maximum ambient temperature (and perhaps, briefly beyond). Colleagues report having had problems getting this processor to reliably exit low power modes at elevated ambient temperatures.
I can find nothing similar to this issue in the May 2011 errata sheets for the MSP430F2619, so I'm wondering if it was only an issue in very early silicon (prior to Rev.H) or if it is only an issue with the -HT version.
1. Has anyone else observed an issue with exiting a low power mode at high temperatures (on any version)?
2. Would you expect the DCO to have trouble as temperature rises? From past experiences, some device PLL's seem to struggle as ambient temperatures rise.
3. If not the DCO, what would you expect to be the first item to fail on this device as ambient approaches (or passes) 150C?
We have no misgivings regarding the impact of elevated temperatures on the device life span. It has to function correctly, but its life is measured in days, not years.
Thanks in advance for any opinions or guidance.