Hi,
This is a 0.4mm pitch DSBGA.
I can't see this info in the datasheet, and the diagrams in AN-1112 are unclear (that it, text is blurred).
The snapEDA footprint looks like the pad diameter is too large.
If I were to make a guess, I think the pad diameter should be 0.23mm, solder mask (NSMD) 0.31mm, and paste 0.25mm square.
Can anyone confirm this please.
Thanks.
