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MSP430F4152: LQFP64 Package Thermal Characteristics

Part Number: MSP430F4152
Other Parts Discussed in Thread: MSP430FR6972

Tool/software:

Hello!

We are going through an Intrinsic Safety Certification process of one of our equipments. The process demands that we calculate the temperature that electronic componentes can achieve under any fail circunstace. To do that, we need to know the ambient junction thermal resistance of LQFP64 package of MSP430F4152.

I already go through datasheet and user guide but can't find this information. I also have read SPRA953D application note anda also haven't find anything.

The certifying body (UL) demands official information from the manufacturer.

Does anyone know were to find this information?

I believe is can be a generic document, not necessarily F4152, but has to be specifically for LQFP64 from MSP430 line.

Thanks in advance!

  • I think the datasheet of F41x2 is an old version, For the later released datasheet, the thermal information is directly put on the datasheet. I can't find the F41x2 thermal information. But please refer to the thermal informaiton of MSP430FR6972 LQFP64. 

    Please remember the thermal reistance is not only related to to the package, but also related to the die size. So it is not a generic document. 

  • Thanks for the support Mr. Zhou.

    The information on this datasheet will help because case has the same die.

    However, I don't know if the UL's certification body will accept the thermal resistance value by similarity (I hope so!)

    I will keep the issue open just in case TI's hardware team has any specific document showing values for MSP430F4152.

    Best regards!

  • I try to find more information for this device internally, but failed.

    Please understand that this is the oldest MSP430 device. Things are changed, both for the website and the MSP team.

  • Thank you again Mr. Zhou!

    I will mark the issue as resolved.

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