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MSP430F2013: MSP430F2013TRSAT : QFN Exposed Pad grounding - Connect to the AGND or the DGND ?

Mohamed Yashar
Prodigy 40 points

Part Number: MSP430F2013

Hello,

We are using  MSP430F2013TRSAT 16-Pin QFN Package in our design. In datasheet it is mentioned that the exposed QFN pad should be connected to VSS.

In our design we have separate AGND and DGND, could you please clarify us should the exposed thermal pad be connected to AGND or DGND ? Since VSS in datasheet refers to DVSS(Digital Ground).

Thanks,

Yashar

 

 

  • 0
    TI__Mastermind 30025 points

    Hello Yashar, 

    If I had to choose, I would use DGND but I think either is fine.  I'm almost certain the thermal pad doesn't have electrical connection to the silicon die inside the package.  The Pad is mostly for mechanical stability of mounting leadless QFN packages.  It's also a "Thermal Pad" and can be used for thermal/heat transfer, but MSP430s can't really use enough power to really generate any meaningful self heating.

    Hope this helps.

    JD

       

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