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MSP430 THERMAL PAD

1074316
Intellectual 775 points

Other Parts Discussed in Thread: MSP430F1232

Hi,

Our client is developing wireless active tag using MSP430F1232
and in order to make some performance improvement,he has to change the pattern of the circuit board.
But in the process of mounting the substrate,
there is a discontuinity in the GND part when expanding the solder cream.

To avoid the above problem he is changing the shape and the size of THERMAL PAD
and want's to know is it ok if the shape and size of THERMAL PAD is changed?

Device  ：MSP430F1232IRHBT
　　　　　RHB（S-PQFP-N32)

【The recommended PAD in DataSheet】　　　　　　　　　　　　　　
　　　　（3.45mm*3.45ｍｍ）no grid
　　　　　↓
　【Changes made】
　　　　（1.40mm*1.40mm）*4units（with grid space 0.30mm ）

Please let me know if this kind of change is correct or not? and does
it lead to any problem in the future.

Thankyou..　

  • 0
    TI__Genius 16215 points

    Chakra,

    If you plan to go with the 4 squares (1.40mm x 1.40mm), make sure they are all connected to GND on the layout. This may be OK if you don't plan to run at high current through it or if it is operating at high temperature conditions.

    As long as the modified pads are within the recommended PAD size, it should be ok.

    Regards,

    William

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