MSP430F5438AIZQW BGA package reference layout

Irfan Awan said:

Can any please refer any reference layout for MSP430F5438AIZQW BGA package   113BGA with .5mm pitch and .25mm pad size.

How small can I make the ball pads for the 113BGA can I go to 0.23mm and still be ok (They recomend 0.25-0.35mm). In the feature I hope TI publishes a reference design with this package so more people are encouraged to use it. 

From what I know, it is not recommended to make smaller pads. Pads can get reduced during PCB production and pads smaller on PCB than they are on the BGA can cause ball deformation and disconnection.

See if this can help you:

http://www.pa.msu.edu/hep/atlas/l1calo/reference/other/mentor/mentor_metric_bga_routing_58105.pdf

Thanks. I guess I will have to thin out my traces. I appreciate your input.

I don't think that thinning the traces is possible, usually the solution for such small pitches is via on PAD. I mean, the free space between pads is approx. 0.25mm which is 10 mil. If you used a 4mil trace, the spacing would be 3mil at each side of the trace. I think it is unaceptable by today standards to use such a small spacing between conductor and pads.