Is there a recommended footprint and breakout for the Microstart BGA package? It's too dense to escape with normal vias. I'm guessing you have to use HDI. Is there an app note on using this package?
Thanks!
CJ
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Is there a recommended footprint and breakout for the Microstart BGA package? It's too dense to escape with normal vias. I'm guessing you have to use HDI. Is there an app note on using this package?
Thanks!
CJ
This question is partly answered on this page on the wiki.
There is also information on page 11 of this document.
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