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More CSP packages.

Andrew Barnes
Intellectual 600 points
Other Parts Discussed in Thread: MSP430FR5738

I have been using MSP430 processors in product design for more then 10 years.  This family has never let me down but time are changing and if the family is to stay relevant I think it has to start offering many of the parts in CSP format.  We have used DIE parts in the past but CSP would allow for cost reduction in assembly.  With a new design in our near future I would like to use a MSP but unfortunately the one that will do the job is not available in a CSP package.  I am attempting to do a design that does not include any DIE parts to remove the need to buy by the wafer and all the extra hassle of dicing and bumping.  There are some ARM based processors that are now available in CSP format and although I would rather stay with an MSP, size and manufacturing cost might drive me to another vendor.


Does TI have any plans to start a CSP program for the MSP430?  I know that it has the MSP430FR573x in CSP but the sleep current is a whopping 1.5uA with RTC enabled ( the MSP430FR59xx can sleep with RTC for 0.25uA, but is not available in CSP).

  • 0
    TI__Guru**** 217867 points
    Hello Andrew,

    TI currently has 26 MSP430 devices that come in a DSBGA package, however the MSP430FR5738 is the only FRAM device with such an option and its LPM3.5 numbers are admittedly inferior to that of other FRAM devices like the MSP430FR59xx family. Is FRAM a necessity for your application and will you be utilizing LPM3.5 during most of the device's run time? I will try to bring a marketeer into this thread to further comment on DSBGA packaging options.

    Regards,
    Ryan
  • 0 in reply to Ryan Brown1
    Intellectual 600 points

    Thanks, BTW, the product search tool does not show the size and square area for any of the DSBGA packages.  It says it has one, but you have to drill down and actually open the datasheet to get the size. 

  • 0 in reply to Andrew Barnes
    TI__Guru**** 217867 points
    Hi Andrew,

    The response from marketing is that future DSBGA packages are being strongly considered across a number of MSP FRAM products but that no definitive timeline has been set for any of these devices.

    Regards,
    Ryan

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