MSP430FR5738: BGA Ball Solder Material

Jacob Olstad

Part Number: MSP430FR5738

Hi,

I'm looking for information on the solder make up of the BGA balls on the MSP430FR5738IYQD. The datasheet has it listed as SNAGCU any more detail on the composition?

Thanks for the help,

Jake

over 8 years ago

0 Ryan Brown1 over 8 years ago

TI__Guru**** 218207 points

Hi Jake,

Sn-AG-CU solder joints are common for BGA components:

iweb.tms.org/.../PbF-0701-10.pdf
thor.inemi.org/.../SAC_BGAs_in_SnPb.pdf
ieeexplore.ieee.org/.../stamp.jsp
www.smtnet.com/.../Attachment.cfm

Regards,
Ryan

0 Clyde Shappee14 over 8 years ago in reply to Ryan Brown1

Prodigy 45 points

What is the specific solder makeup?

I need to know the number of the SAC (i.e. SAC 105, 305, 405, etc.)

Clyde

0 Ryan Brown1 over 8 years ago in reply to Clyde Shappee14

TI__Guru**** 218207 points

www.ti.com/.../materialcontentsearch.tsp

Regards,
Ryan

**Attention** This is a public forum

MSP low-power microcontrollers

MSP low-power microcontroller forum

MSP430FR5738: BGA Ball Solder Material