• State
  • Locked Locked
  • Replies 6 replies
  • Subscribers 82 subscribers
  • Views 1462 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

MSP430FR2632: MSP430FR2632 thermal size issue

Ashley Kao
Intellectual 360 points
Part Number: MSP430FR2632

Hi,

My customer must to MSP430FR2632 thermal size.

The document isn't marked the size .

www.ti.com/.../mpqf124f.pdf

please help.

thanks

Ashley

  • 0
    Guru 74080 points

    Hi Ashley!

    Here you are:

    It is true that this information is missing in the datasheet.

    Dennis

  • 0 in reply to Dennis Eichmann
    TI__Genius 13875 points

    Dear Dennis

    Customer asked to add this information into our datasheet so they can pass their quality team.

    I think they just need a TI official document which indicated this parameter.

    Could you add it to the datasheet?

  • 0 in reply to Jefferey
    Guru 74080 points
    Hey Jefferey!

    Unfortunately I cannot ;) I do not work for TI, I'm only a customer. You can submit documentation feedback at the bottom of the datasheet. Or maybe can help.

    Dennis
  • 0 in reply to Dennis Eichmann
    TI__Guru**** 217007 points
    Hey Jefferey, Dennis,

    I'll pass this along to the Documentation Team, thanks for the heads-up. A CAD file (.bxl) with the correct thermal pad dimensions is also provided on the product's quality page: www.ti.com/.../quality

    Regards,
    Ryan
  • 0 in reply to Ryan Brown1
    Prodigy 10 points
    Ryan,

    Dennis attached a pdf which conflicts with the land pattern in the .bxl. The pdf states the thermal pad is 2.45x2.45 +/- .1. The thermal pad in the .bxl is 2.1 x 2.1mm. I believe TI manufactures at least 3 different RGE thermal pad sizes, 2.1mm sq, 2.45mm sq (based on Dennis's attachment) and 2.8mm sq. from another component (bq24167RGE) in my library.

    This is the 2nd part I've worked on in 2 days I've been unable to locate thermal pad data that I feel like I can trust. The other was LMZ35003RKG. The .bxl for the land pattern for this part is corrupt.

    I understand that TI is recommending customers download the .bxl to get the correct dimensions of the thermal pad. This is not a good option for me. Although I can do this, it's not easy. I'm not permitted to install applications on my internet workstation so I have to move them to my engineering workstation. Due to network security restrictions it's not easy to make this happen either. I have to create the land pattern for this part because the one provided through the .bxl does not meet our standards plus we require 3 land patterns to be available for use depending on the complexity and method that will be used to assemble the board. I also need to make the dimensional data available to my customers and quality staff. This can't be done from the .bxl either. Please request thermal data be added back into all datasheets.

    Any help you can provide convincing those in authority to put the thermal pad dimensions back in the datasheet is appreciated. In the meantime, can you verify that the thermal pad for MSP430FR2632RGE is a 2.1mm square?

    Thanks,
    Sheila
  • 0 in reply to Sheila Edwards
    Guru 74080 points

    Sheila Edwards said:
    Dennis attached a pdf which conflicts with the land pattern in the .bxl. The pdf states the thermal pad is 2.45x2.45 +/- .1. The thermal pad in the .bxl is 2.1 x 2.1mm. I believe TI manufactures at least 3 different RGE thermal pad sizes

    That's interesting - thanks for the info! Will also have a look at that.

**Attention** This is a public forum