MSP low-power microcontrollers

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MSP430FR2633: Captivate

Abhishek Vazrekar

Intellectual 420 points

Part Number: MSP430FR2633

Will Captivate technology (both self and mutual ) work if there is an air-gap between the PCB and the frontpanel ?

over 8 years ago

0 Ryan Brown1 over 8 years ago

TI__Guru**** 219527 points

Hello Abhi,

Please read the Design Guide -> Best Practices section of the CapTIvate Technology Guide. Air is a low-dielectric medium which involves a low breakdown voltage (susceptible to ESD and device damage) and proportionally affects the system's sensitivity. Self capacitance systems should limit air gaps to less than 2 mm whereas mutual designs should avoid it entirely.

Regards,
Ryan

0 Abhishek Vazrekar over 8 years ago in reply to Ryan Brown1

Intellectual 420 points

If I use spring for filling the air gap between the PCB and overlay,Can I use mutual capacitance technique ?

0 Ryan Brown1 over 8 years ago in reply to Abhishek Vazrekar

TI__Guru**** 219527 points

No, the spring needs to be located underneath the PCB or some other workaround must be devised. What is your application?

Regards,
Ryan

0 Abhishek Vazrekar over 8 years ago in reply to Ryan Brown1

Intellectual 420 points

It's a remote and is curved from top.

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