MSP430FR2532: FRAM data retention at high temperature

Keigo Ishii

Part Number: MSP430FR2532

Hello,

I found the below description in MSP430FR2532 device datasheet.

Data retention on FRAM cannot be ensured when exceeding the specified maximum storage temperature, Tstg. Therefore, programming of devices with user application code should only be performed after soldering.

Could you please tell me about followings.

(1)
Does it mean that the code programmed before soldering will be lost by high temperature of the reflow process?

(2)
Do FRAM devices always have this problem?

Best regards,
Keigo Ishii

over 8 years ago

0 Ryan Brown1 over 8 years ago

TI__Guru**** 219417 points

Hi Keigo,

This legacy note is included in the MSP430FR2532 datasheet by error as it only applies to MSP430FR57xx devices. Action is already being taken to remove this note from all affected datasheets.

Regards,
Ryan

0 Keigo Ishii over 8 years ago in reply to Ryan Brown1

Intellectual 820 points

Hi Ryan-san,

Thank you for your reply.

Could you confirm my understanding is correct?
My understanding is:

Data retention on FRAM is ensured even if the FRAM device was programmed before soldering.

As my customer is planning to program before soldering, this is the confirmation just in case.

Best regards,
Keigo Ishii

0 Ryan Brown1 over 8 years ago in reply to Keigo Ishii

TI__Guru**** 219417 points

This is correct Keigo, please refer to Section 2.2.1 of the MSP430 FRAM Quality and Reliability App Report (SLAA526): www.ti.com/.../slaa526a.pdf

Regards,
Ryan

0 Keigo Ishii over 8 years ago in reply to Ryan Brown1

Intellectual 820 points

Hi Ryan-san,

I got it, I'm relieved to hear that.

Best regasrds,
Keigo Ishii

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MSP430FR2532: FRAM data retention at high temperature