MSP430F2618: Crack under solder reflow

user5094244

Part Number: MSP430F2618

We have 600pcs MSP430F2618TPNR surface mount on our PCB under solder reflow, and we found there are about 20pcs MSP430F2618TPNR cracked.

I'm not sure what cause this. These MCUs is made at the year 2009, but the Moisture Barrier Dry Packing is good.

over 7 years ago

0 Uwe430 over 7 years ago

TI__Prodigy 215 points

Hello,

thank you for contacting TI regarding the issue you have seen after reflow of MSP430F2618TPNR.

From the picture it is hard to say what happened exactly to the device to show this type of cracking. It seems that the maximum soldering ratings are somehow exceeded or moisture was present in the devices.You may check whether the Humidity Indicator Card is showing moisture even if the moisture barrier bag was good. Moisture in the IC package can lead to pop corn effects during soldering.

Absolute Maximum Ratings for Soldering apply to the devices which are described in the application note: www.ti.com/.../snoa549d.pdf , or www.ti.com/.../snoa550e.pdf.

For further reference you may have a look as well to the "Plastic Package Moisture-Induced Cracking" application note.

Regards,

Uwe

0 user5094244 over 7 years ago in reply to Uwe430

Prodigy 20 points

Hi,
Thank you for reply. I will check the maximum soldering ratings and the Humidity Indicator Card. I also have another question, the no cracking devices which have been mounted on the PCB will be effected by this soldering event?

0 Uwe430 over 7 years ago in reply to user5094244

TI__Prodigy 215 points

Hi,
this could not be said right now. You may verify the condition first and see if those are applied correctly.
Thanks & regards Uwe

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MSP430F2618: Crack under solder reflow