MSP-EXP430F5529LP: request advice how to minimize LP and get data to mobile

Hi ti4tst,

Seems that your request is similar to some EVM that TI provide. We call them "BoosterPack". You can search "boosterpack" directly at ti.com for more information.
You must have noticed the 40-pin headers on the LP. You can build up a board similar to the BoosterPack by leveraging the 40-pin header, using all the peripherals you want (such as ADC, timer, etc.).

For the USB data transfer, we have a "back channel UART" on the LP, connected the UART with F5529's P4.4/P4.5 pins. Shown as below.

You can use that for data transfer. And you can also find if you connect the LP to the PC, there will show up two serial port in your hardware management, shown as below. the Application UART1 is the back channel UART that could be used for data transfer. Sorry that I don't know much about mobile development, but my understanding is that all you need to do in your mobile phone is to call a similar API in PC for this COM port if your platform have.

Let me know if this helps.

Regards,

Harry

This can be done by 5529 LP, and at the end, if size is important, board can be made with MSP430F5510. All MSP430 USB devices are with factory preloaded USB boot loader, so updating the code (without FET) is not a problem. For connection with android device check...

http://www.ti.com/lit/an/slaa630/slaa630.pdf  (Android Applications With MSP430 USB on Mobile Devices)

Hi Harry,

Thank you so much for your info-rich post.
Will try to work with it after digesting it.

After looking with magnifying glass at the LP and the accompanying pin layout card, I was unable (forgive the noob) to find P4.4/P4.5.
However, for the LP, Windows 7 installed 8 drivers, incl the two by you depicted ports.

Many thanks for your help (admittedly I will probably be back!) and best regards!
:)

Here is 10 x 50 mm, with not perfect precision...

I think there should be no any problems whit placing chip with components on few mm wider pcb. There are is also other, smaller package, for example QFN, but I never found that this help to final result because on LQFP package space under the chip can be used for routing, while with QFN is reserved for thermal pad.

There are plenty of micros with USB hardware module, that can be used as USB device without  external precise clock source. Unfortunately, TI devices use external one, and by default 4/8/12/24 MHz are supported by factory bootloader, so pick one whit small footprint. Don't know about battery.

Thank you, zrno soli, this is a great example re space allocation.

Re frequency, if I understand correctly, it is better to take 4 MHz, since that might be smaller and use less energy; however, if no precise clock is needed, then it might work without external clock?

Again, thank you so much for letting me learn from your experience!

Hi,
It seems your concern has been resolved, please help advise whether there is other issue? if not, I will close this thread, thanks a lot!

Please keep it open, I have a still many things to learn and ask. Thank you.

Thanks for the tip. I cannot find HF X2, where is that?