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MSP430FR2522: PCB Component Placement Consideration

erik lee2
Genius 3060 points
Part Number: MSP430FR2522


Dear Sir,

if the sensor pad is placed on the top side of the PCB, can I place the MSP430 on the bottom side directly back to the sensor pad? As we know, it's better place the grid ground pure on the other side of sensor pad, but it's limited by PCB size.

  • 0
    TI__Guru 71216 points
    Hi Erik,

    Yes, although this is not ideal. To minimize coupling between digital signals, such as the Spy-By-Wire, UART, I2C, PWM, etc. and the sensor electrode, try to locate the MCU so it is not directly underneath the sensor.
    If you have to place the MCU under the electrode, do the best you can to place the MCU so the digital pins/signals described above are not under the electrode.
    What size are the electrodes and are they buttons or proximity electrodes?
  • 0 in reply to Dennis Lehman
    TI__Guru 71216 points

    Hi Erik,

    Here is an example of recommended layer stack up and grounding.  Note the MCU is underneath the electrode but the electrode is shielded by the hatched ground pour on L2.

  • 0 in reply to Dennis Lehman
    TI__Guru 71216 points

    Hi Erik,

    I haven’t heard from you for a couple of days now, so I’m assuming you were able to resolve your issue.
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