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MSP430F5328: Thermal Pad connection to GND?

Matthias Schmitt
Expert 5740 points

Part Number: MSP430F5328

Dear MSP430-BU,

can you please clarify if the Thermal Pad of the MSP430F5328IRGC is recommended to be connected to GND?

There is nothing mentioned in the datasheet (SLAS678E).

For similar devices like the F5528 it is mentioned in the terminal function table (table 3) that the QFN Pad should be connected to Vss (GND).

Can you please clarify how this is supposed to be handled for the F5328?

Thanks,
BR,
Matthias

  • 0
    TI__Genius 17960 points

    Hello Matthias,

    there are only a few MSP430 derivatives, where the power pad really is bonded to supply GND of the device die. One example are the CC430 derivatives, where we're intentionally due to RF performance requirements use the power pad as Vss connection.

    For the MSP430F5328 it is not the case. The generic best point to check this is the "Terminal Functions" or "Signal Descriptions" table in the device datasheet.

    The recommendation to connect the power pad to application GND or device Vss supply has in this case two other reasons.

    1. Though not intentionally bonded, there is a limited isolation of the die, which in packages with power pad is "glued" directly on the power pad. Thus there is a limited isolation between die and power pad.

    2. As the die is placed directly on top of the power pad, the capacitive coupling between power pad and modules and structures on the chip is quite high. Thus any disturbances coupling into the power pad, could respectively couple into sensitive device areas and modules, and affect negatively the performance and safety of operation.

    Best regards

    Peter

  • 0 in reply to Peter Spevak
    TI__Genius 17960 points

    Hello Matthias,

    under the assumption, your question has been answered sufficiently, I am closing this thread.

    Best regards

    Peter

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