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Hi Jerry,
Could you describe your detailed about project requirements? Why do we need bare die?
If you just want to obtain the unique information of the device to identify the MCU, you can directly read and use the Lot/wafer ID, Die X position and Die Y position of the TLV inside the MCU.
Best Regards
Johnson
Hi Johnson,
The main reason we are looking for a bare die solution is we are looking to wirebond this directly and avoid magnetic interference caused by the packaging materials. If necessary please feel free to call or email me directly, I would like to lock in this design by today if this is a valid solution for us.
Thanks and best,
Jerry
Hi Jerry,
I am not sure whether we can provide these services or information, I will confirm with the relevant teams and come back.
Best Regards
Johnson
Hi Jerry,
I think you can directly contact our TI Sales for your requirement.
Best Regards
Johnson
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