MSP430FR5969-SP: thermal pad

Justin Bailey

Part Number: MSP430FR5969-SP
Other Parts Discussed in Thread: MSP430FR5969

Note 4 on page 136 of the data sheet says the package is designed to be soldered to a thermal pad on the board. Which thermal pad do you recommend?

over 5 years ago

0 Eddie LaCost over 5 years ago

TI__Mastermind 47215 points

Hi Justin,

The thermal pad of the package should be connected to a PCB pad connected to GND. The recommended land pattern is shown in the diagram. You can also generate the CAD symbols for various CAD software from the tool below. I don't see the -SP version in the tool, but you can find the MSP430FR5969 which is the same package.

https://webench.ti.com/cad/

0 Justin Bailey over 5 years ago in reply to Eddie LaCost

Prodigy 30 points

Hi Eddie, thanks helpful. Do I understand correctly, no secondary thermal pad is recommended?

0 Eddie LaCost over 5 years ago in reply to Justin Bailey

TI__Mastermind 47215 points

Right, you just connect the thermal pad of the package to the ground plane of the PCB through vias.

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MSP430FR5969-SP: thermal pad