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MCT8316Z: MCT8316Z0TRGFR short to the GND during stress test and board burnt

Part Number: MCT8316Z

Hi TI E2E team;

Good day, currently our customers are doing a stress test for the Turnstile project that is using MCT8316Z0TRGFR and facing some issues.

Unfortunately when they kick the gentry as video above, the MCT8316Z0TRGFR will short to the GND and their board burnt as image below.

 Do you have any solutions to overcome this issue? Thank you so much.

  • Hi Wei, 

    Thanks for posting your questions to the e2e forum 

    we'll aim to provide a response next week on answers & next steps 

    Best Regards, 
    Andrew 

  • Hi Wei,

    We need more system level details to understand what this stress test means to our device. Can you answer below questions to help us understand this better?

    1. Share the board schematic

    2. Please do a visual inspection on the board and try to locate which pin of the IC has been damaged.

    3. What happens electrically, when this stress test is performed? For example, motor gets overloaded, motor gets damaged, voltage spike on DC supply voltage etc.  

    Regards,

    Vishnu

  • Hi Wei, 

    Closing this thread - please let us know if you need further assistance, and help mark the answer above as 'resolved' if it answered your question. Thanks!

    Best Regards, 
    Andrew