BQ25883: Reviewing BQ25883's layout

HI Mickey,

Below is the top layer of the layout with some notes that I will explain.

1.  Is there a ground pour underneath the power pad?   If not, I recommend one and/or adding more GND vias near the IC GND pins.

2.  Please add more GND vias for the REGN, BAT and SYS cap grounds.

3. The SYS decoupling cap is likely too far away from IC SYS and GND pins to be effective.  

4. I recommend adding a small decoupling capacitor close to the IC and either another bulk capacitor for PMID or a bigger footprint for large capacitance capacitors for PMID.  This device is a bit sensitive to input line inductance.  The addition capacitance mitigates that effect.  

5. The BTST cap requires a long noisy trace on layer IN3. I thought it result in a shorter trace if that cap was placed on the bottom layer but I looked at the EVM and it has a long trace too.  So you can ignore this suggestion.

Regards,

Jeff