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I have had to revert to using the BQ25790 instead of BQ25792 because it has better availability.
Looking at these parts, it seems the only main difference is the PCB package. I think this question has been covered elsewhere?
Regarding the PCB layout for BQ25790, the EVM suggests:
VIA in PADs - the BGA pads have filled vias in them
Double-sided SMD assembly - SMD parts on both sides
Both of these will add considerable cost to my PCBA. Is there any way to layout BQ2570 without either of these? Or should I follow the recommendations and absorb the cost?
Thanks
David
Dear David,
Several of the BQ25790 pins, such as D-, ILIM_HIZ, and PROG, are located in the middle of the IC and cannot be routed directly out of the package because doing so would interfere with other pins. Therefore vias are needed to break these and other pins out.
The EVM is our recommended layout in order to place the required SYS output capacitors and inductor SWx connections as close as possible to the IC. Please follow the layout guidelines and priorities given in Section 11.1.
Thanks,
Mike Emanuel
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