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Proper layout of the AGND to AGNDSNS connections, PGND to System ground connections, and VDD bypass can affect the sensed current.
Soldering quality of the thermal pad ground connection, which carried the current.
Stability of the loop, if the loop is not stable and oscillating or generating bursts of 2 or more SW pulses between extended off-times can all increase the sensed current and thus decrease the current limit trip point.
Also, over heating the IC during reflow can reflow the internal high-temperature die attach and increase the Rdson used for current sense, causing the OCP to trigger early.
