TPS22916: TPS22916BYFPR Help / Experience in Quality

Andrea Sturm

Part Number: TPS22916

Hello TI-Team,

we have with the above mentioned components again and again parts with such a damage as in the photo attached.
Are there certain handling specifications / conditions for the components that we have to pay attention to during storage?
Do you have other customers who have experienced the same problem?
We attach these components with a UV adhesive and then place them in a designated machine for curing.
Does it affect the component if we place this component on an assembled PCB in a UV curing machine for about 180 seconds?
Can these become brittle / porous as a result?
Are there any studies or experiences, influences on this from your side?

Thank you for your reply
Best regards
Andrea Sturm

over 2 years ago

0 Elizabeth Higgins over 2 years ago

TI__Genius 16145 points

Hi Andrea,

Please review the following FAQ for information and recommendations on soldering/handling WCSP devices, specifically the TPS22916.

https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/1135223/faq-tps22916-soldering-handling-wscp-to-ensure-expected-performance

Best Regards,

Elizabeth

0 Andrea Sturm over 2 years ago in reply to Elizabeth Higgins

Prodigy 10 points

Hi Elizabeth,

thank you very much for your reply. Could you also give us an answer on the following questions? This is an important point for us

Does it affect the component if we place this component on an assembled PCB in a UV curing machine for about 180 seconds?
Can these become brittle / porous as a result?

Thank you in advance

Best regards

Andrea

0 Elizabeth Higgins over 2 years ago in reply to Andrea Sturm

TI__Genius 16145 points

Hi Andrea,

We do not have this information on hand and do not likely characterize it. However, allow me a couple days to reach out to our internal teams to discuss.

I will let you know what the conclusion is.

Best Regards,

Elizabeth

0 Elizabeth Higgins over 2 years ago in reply to Elizabeth Higgins

TI__Genius 16145 points

Hi Andrea,

I have assigned this thread to the proper contact.

We will put this is our queue and prioritize it accordingly.

Best Regards,

Elizabeth

0 Andrea Sturm over 2 years ago in reply to Elizabeth Higgins

Prodigy 10 points

Hi Elizabeth,

do you already have some news on this topic?

Thank you

Best regards,

Andrea

0 Karl Fleischmann over 2 years ago in reply to Andrea Sturm

TI__Expert 3625 points

Hello Andrea,

I discussed with our packaging team.

A UV cure for an adhesive should not impact the package material properties to make it more porous or brittle. TI does a UV-tape mount and cure during assembly and we do not see issues with the silicon through this process.

Based on review from our team, it looks like this could be damage induced during handling, which Elizabeth mentioned in her initial response.

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TPS22916: TPS22916BYFPR Help / Experience in Quality