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hello
For wide vin ldo with low iq, any recommendation to meet vin-gnd distance>1mm?
Dongbao
Hi Dongbao,
I don't understand the question. Can you explain what you mean by vin-gnd distance>1mm?
Thanks,
Nick
VIN pin to GND pin distance (include heatsink/GND) shall bigger than 1mm to reduce the possibility of short due the stray conductive filaments in pcb, this is required by Nissan.
Hi Dongbao,
Got it.
Can you provide an estimation for how "low" the Iq needs to be for this application?
Is there a size restriction? The large pin pitch will probably mean a large package.
Also, what is the load requirement? By "wide VIN" do you mean 40V?
Regards,
Nick
Does HTSSOP and TO-252 package of tps7b82 meet such requirements?
I look through the package dimension,it looks good.
Hi Dongbao,
I don't know what the requirements are; that is why I asked for them. If the Iq spec is acceptable for TPS7B82-Q1 then this looks like a good option at a basic level. I agree that the package should meet their requirement.
Regards,
Nick