TPS61042: Question about SON(DRB) package foot pattern.

Hi Kazuya,

I think this is related to PCB soldering pad size design, so I would suggest customer to double check with their own designed PCB with the new package to see if there is assembly issue.

BR

Patrick

Hi Patrick,

Thank you very much for your reply.

Could I ask you an additional question?
Do you have any recommended foot pattern information for TI CDAT package?

Thank you again and best regards,
Kazuya. 

Hi Kazuya,

Unfortunately I don't have this information.

BR

Patrick

Hi Patrick,

Thank you very much for your reply and I'm sorry to be late my response.

The customer worry about a thing described in the attached file.
Could you please give me TI thought?

Thank you again and best regards,
Kazuya.

TPS61042_addtional_pakage_question101923.pdf

Hi Kazuya,

Understood, let me check internally and give you feedback later.

BR

Patrick

Hi Kazuya,

We think the new package together with old thermal pad is having low risk for soldering. However, it is recommended for customer to follow our new package land pattern guide.

BR

Patrick

Hi Patrick,

Thank you very much for your strong supports.

How can we get the new package land pattern guide?

Thank you again and best regards,
Kazuya. 

Hi Kazuya,

I have sent you a private message.

BR

Patrick