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Tool/software:
Hi, Ti power management team
Can i replace the TLV62130 in the following two scenarios:
Application
MCU Power
BATTERY Input Source
Questions
1) For the TPS563206, the SW pin is connected to the BTST pin via a Via. Will this have a negative impact on EMI?
2) Is it acceptable to connect the SW pin with a thin trace?
3) Are there any precautions to take?
Regards.
Jeong.
Hi Jeong,
First answer your questions.
1) SW to BST connected by via is not must, it can be routed on same layer.
2) SW pin to inductor should be wide.
3) Iq of TPS563206 is higher than TLV62130, and TPS563206 works in FCCM mode, that means TPS563206 will consume more power at light load. so if you need long battery life, this device is not suitable.
The next generation of TLV62130 is TPS62903. You can use this.
Regards,
Shipeng
Hi, Shipeng
Thank you for your reply.
I want replace the TLV62130 with a low cost IC.
Questions:
Regards.
Jeong
Hi Yongki
Shipeng will check and get back to you later.
Thanks and best regards.
Hi Jeong,
1.It's no matter Cboot is closer to SW or BST but the total length should be short.
2.the width from SW to BST can be thin, but the width should not less than pin width.
3.Both method is acceptable. Usually we put a via near SW pin to connect to BST.
4. If you don't care about power consumption, it will be OK.