Other Parts Discussed in Thread: LMG3526R050
Tool/software:
Hi all,
I have a question about the location of the heat sink.
This device is a bottom-heatsink, while the LMG3526R050 is a top-heatsink.
What is the difference between bottom and top?
Top: More flexibility in design to lower the temperature by attaching fins, etc.
Bottom: Since it can be attached directly to the substrate, there is no need to attach fins, etc.
Am I correct?
Best Regards,
Ryusuke
