Tool/software:
Dear Specialists,
My customer would like to confirm that there are no problems mounting the new package on the land pattern of the old package.
I would be grateful if you could advise.
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According to a related thread,
it has been mentioned that there is no problem with mounting the new package on the land pattern of the old package.
Is it possible to understand that there are no concerns about solder balls, etc.?
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I appreciate your great help in advance.
Best regards,
Shinichi