Tool/software:
Hi Team,
Did we have standard tin volume to avoid solder insufficient issue of TPS22990 thermal pad?
Regards,
Ben
Hi Amrit,
They face to solder insufficient issue before, and asking TI's recommendation back to that time. (Not under my accounts when issue happened, I don't have issue detail information on hand)
But now they face to solder short or excess solder issue.
Base on my experience, it's excess solder issue. I think they need to improve SMT manufacturer side.
However, what I provide to them is "SOLDER PASTE EXAMPLE" in datasheet. (0.125 mm THICK STENCIL)
But not sure if we have the requirement of my post or not.
Regards,
Ben
Hi Amrit,
I am working on to get solder thickness information, and will keep you update.
Please also let me know if you get information from PE team.
We will have meeting with customer next Thursday. I would like to get all information before this meeting.
Please share PE team's comment before next Tuesday.
Regards,
Ben