TPSM82903: bake condition

Tool/software:

Hi all,

I would like to know baking condition of TPSM82901SIS and TPSM82903SIS.

it is recommended to refer to the SMD thickness of 0.34mm, In E2E below, 

TPSM82903: The value of Package Body thickness for bake condition - Power management forum - Power management - TI E2E support forums

Therefore, From Table 5, I understand that baking is not necessary because 0.34 mm is a value of 0.5 mm or less. 

Is it correct?

Best Regards,

Ryusuke