LM65645-Q1: Heat cycle test for solder crack reliability

Yusuke Okamoto

Part Number: LM65645-Q1
Other Parts Discussed in Thread: LMR38025-Q1,

Tool/software:

Hi Experts,

Could you provide reliability test data document of step cut and dimple package for solder tolerance under heat cycle test?

Best Regards,

Yusuke

0 Frank De Stasi 7 months ago

Hello

I will speak with our PE and get back to you as soon as possible.

Thanks

0 Frank De Stasi 7 months ago in reply to Frank De Stasi

Hello

Please see information attached.

Thanks

0 Yusuke Okamoto 7 months ago in reply to Frank De Stasi

Hi Frank,

Could you also provide dimple type package weibull plot such as LMR38025-q1 to compare with LM65645-Q1(step-cut)?

Best

Yusuke

0 Frank De Stasi 7 months ago in reply to Yusuke Okamoto

Hello

Let me see what we can do.

Thanks

0 Frank De Stasi 7 months ago in reply to Frank De Stasi

Hello

Please keep in mind that this device is not yet released and not all information is available yet.

You can go to the following link to request more information: https://www.ti.com/ppap

Thanks

0 Yusuke Okamoto 7 months ago in reply to Frank De Stasi

Hi Frank,

Could you share a picture of how the IC is settle with solder when installed on the board? (EVM is OK)

Best Regards,

Yusuke

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