• State TI Thinks Resolved
  • Locked Locked
  • Replies 1 reply
  • Answers 1 answer
  • Subscribers 63 subscribers
  • Views 53 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

Original question:

TPS5430 over heat issue

TPS5430: TPS5430DDAR Thermal management

Sankar S
Prodigy 20 points
Part Number: TPS5430

Tool/software:

I'm using the TPS5430DDAR in my circuit. The input voltage is 24V nominal, with a maximum of 30V, and the output is 5V at 200mA. However, the IC is heating up to 55 to 60°C.

So far, the output voltage and current are stable and accurate  there’s no visible issue with performance. But I’m concerned about the heat during long-term operation, especially since we plan to use this part in mass production.

  • Could there be any issue with my design causing this heat?

  • Will this temperature affect long-term reliability?

  • What suggestions do you have to reduce the heat dissipation?

  • 0
    TI__Genius 14196 points

    Hello Sankar

    Sankar S said:
    I'm using the TPS5430DDAR in my circuit. The input voltage is 24V nominal, with a maximum of 30V, and the output is 5V at 200mA. However, the IC is heating up to 55 to 60°C.

    What was the ambient during this test? Could please share captured thermal image?   


    The recommended max operating junction temperature for this device is 125deC. If operating junction temperature is below this level, it should be okay. What is max the ambient temperature in your application?

    Additionally, could you please share picture of internal layers to get idea of how thermal pad is connected to GND polygon.

    Thank you

    Regards

    Onkar Bhakare