Tool/software:
We encountered 100% failure rate when use part with below trace code marking.
From the Xray result, there is differences in the wire bonding pattern.
Attached also the troubleshooting result.
We had sent Failure analysis, however the IC passed ATE test . TI quality team ask us to proceed to further debug on the application level with the support from TI’s E2E platform
TM3009021 TI IC .pptxTPIC6A595DWR troubleshooting result.xlsx