UCC28C56EVM-066: EVM Thermal Design Considerations

Part Number: UCC28C56EVM-066

Tool/software:

Hi TI,

I'm reviewing the UCC28C56EVM-066 reference design and would appreciate some insights into the thermal and high voltage design principles applied in this evaluation module.

Specifically, I'm interested in understanding:

  • How thermal management was approached in the layout and component selection.
  • What isolation and creepage/clearance strategies were used to ensure safety and compliance in high voltage operation.
    • There appears to be a gap under the T1 component that exposes the coil windings. Is that air gap for electrical creepage clearance or does TI recommend using gap pad to conduct heat away from the coil windings in high load conditions?
  • Any design trade-offs or best practices that were considered for optimizing performance under high voltage stress.

I reached out to coilcraft and they sent me the attached spreadsheet on temperature measurements of the transformer coils under load with and without the transformer lid. If there are any application notes or internal guidelines that expand on these aspects, I’d be grateful for a pointer.

UCC28C56EVM w_ZD2200-BE Test 9_13_2022.xlsx

  • Hi,

    1)

    Use natural convection sense to make component orientation. Transformer has been changed many times with each time to find where the hot spot is then talk to the vendor to modify.

    2)

    IEC 61010-1  3rd. Ed

    As long your design meets the above standards then ok.

    3)

    Frequency, switching power losses, and converter size.

  • My enclosure is cold wall cooled with no free airflow. What does TI recommend for adapting the design for cold wall cooling? Would I need to pot the pcb?

  • Hi,

    You could use thermal conductive but electrical insulated material like thermal pad to mount MOSFET to the enclosure wall as heatsink. If you cannot, then potting / filler of thermal conductive material would be ok to use.