This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

Drill size of vias under pad on the BQ51013YFF

Hi,

what is the recommended drill size for the vias residing on certain pads of a printed circuit board that will accept the BQ51013YFF. Do the vias have to be filled before applying the solder paste on the pads. If yes, what is the preferred filling material (resin, solder or other).

Thanks