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TPS3850-Q1: TPS3850-Q1,TPS3852-Q1:About size,shape and chamfering of thermal pad.

Noritomo Harukawa
Intellectual 990 points
Part Number: TPS3850-Q1
Other Parts Discussed in Thread: TPS3852-Q1, TPS3850, TPS3852

Confirmation about TPS3850-Q1 and TPS3852-Q1.

Q1.
It is confirmation about TPS3850-Q1.
I want to confirm the chamfer size of the thermal pad.
However, the chamfer size is not described in the TPS 3850-Q1 datasheet.
Could you teach about chamfer size of TPS3850-Q1?

*
The TPS3850 datasheet described the chamfer size. (C 0.30)
Is TPS3850-Q1 the same as this?

Q2.
It is confirmation about TPS3852-Q1.
I want to confirm the size,shape and chamfer size of thermal pad.
However, none are described on the TPS3852-Q1 datasheet.
Could you teach about size,shape and chamfer size of thermal pad?

-Harukawa

(TPS3850_52-Q1)About size,shape and chamfering of thermal pad.pdf

  • 0
    TI__Genius 12630 points
    Harukawa,

    A1. Yes, TPS3850-Q1 and TPS3850 use same chamfer size and same package size.

    A2. We do not provide the chamfer specifications for this device. Please follow the recommended layout provided in Section 10.2. As you can see, no chamfer specs are required as we recommend a rectangle shape for the thermal pad to provided maximum heat dissipation.

    All of the information we provide for the package size and shape is provided in the datasheet. If we don't provide dimensions of the chamfer, then you can use a simple rectangle shape rather than a shape with chamfer. I hope this helps! Let me know if you have any other questions. Thank you!


    -Michael
  • 0 in reply to Michael_DeSando
    Intellectual 990 points

    Michael-san

    Thank you for reply.

    I have some questions.

    It is confirmation about TPS3850-Q1.

    Q1.
    The package size is described on pages 36 and 43 of the TPS3850-Q1 datasheet.
    Which page is correct information?
    (I think the information on page 36 is correct. I think the information on page 43 is a mistake.)

    Q2.
    On page 36 of the datasheet, the chamfer size is stated as "OPTIONAL".
    Does the thermalpad of the TPS3850-Q1 surely have a chamfer?
    (Is there a rectangular thermal pad too?)


    It is confirmation about TPS3852-Q1.

    The TPS3852-Q1 datasheet does not contain information on the dimensions and shape of the thermalpad.
    ("THERMAL PAD SIZE AND SHAPE ON SEPARATE SHEET" is stated on page 29 of the datasheet, but there is no such separate sheet.)
    Also, the land pattern information is not described.

    Q3.
    On page 30 of the TPS3852 datasheet, thermalpad dimensions and shapes are described.
    Is TPS3852-Q1 the same as this?

    Q4.
    On page 30 of the TPS3852 datasheet, LAND PATTERN DATA are described.
    Is TPS3852-Q1 the same as this?

    Q5.
    > We do not provide the chamfer specifications for this device.
    > If we don't provide dimensions of the chamfer, then you can use a simple rectangle shape rather than a shape with chamfer.

    From the above answer, I understood that the thermalpad shape of TPS3852-Q1 is a rectangle.
    (That is, there is no chamfer.)

    Is it correct?


    *
    I am referring to the following datasheet.

    TPS3850-Q1 :SBVS264A
    TPS3850 :SBVS301A
    TPS3852-Q1 :SBVS285
    TPS3852 :SBVS302

    -Harukawa

  • 0 in reply to Michael_DeSando
    Intellectual 990 points

    マイケルさん

    返信ありがとうございます。

    私はいくつかの質問があります。

    TPS3850-Q1についての確認です。

    Q1.
    The package size is described on pages 36 and 43 of the TPS3850-Q1 datasheet.
    Which page is correct information?
    (I think the information on page 36 is correct. I think the information on page 43 is a mistake.)

    Q2.
    On page 36 of the datasheet, the chamfer size is stated as "OPTIONAL".
    Does the thermalpad of the TPS3850-Q1 surely have a chamfer?
    (Is there a rectangular thermal pad too?)


    It is confirmation about TPS3852-Q1.

    The TPS3852-Q1 datasheet does not contain information on the dimensions and shape of the thermalpad.
    ("THERMAL PAD SIZE AND SHAPE ON SEPARATE SHEET" is stated on page 29 of the datasheet, but there is no such separate sheet.)
    Also, the land pattern information is not described.

    Q3.
    On page 30 of the TPS3852 datasheet, thermalpad dimensions and shapes are described.
    Is TPS3852-Q1 the same as this?

    Q4.
    On page 30 of the TPS3852 datasheet, LAND PATTERN DATA are described.
    Is TPS3852-Q1 the same as this?

    Q5.
    > We do not provide the chamfer specifications for this device.
    > If we don't provide dimensions of the chamfer, then you can use a simple rectangle shape rather than a shape with chamfer.

    From the above answer, I understood that the thermalpad shape of TPS3852-Q1 is a rectangle.
    (That is, there is no chamfer.)

    Is it correct?


    *
    I am referring to the following datasheet.

    TPS3850-Q1 :SBVS264A
    TPS3850 :SBVS301A
    TPS3852-Q1 :SBVS285
    TPS3852 :SBVS302

    - 原川

  • 0 in reply to Michael_DeSando
    Intellectual 990 points

    Michael-san

    Thank you for reply.

    I have some questions.

    It is confirmation about TPS3850-Q1.

    Q1.
    The package size is described on pages 36 and 43 of the TPS3850-Q1 datasheet.
    Which page is correct information?
    (I think the information on page 36 is correct. I think the information on page 43 is a mistake.)

    Q2.
    On page 36 of the datasheet, the chamfer size is stated as "OPTIONAL".
    Does the thermalpad of the TPS3850-Q1 surely have a chamfer?
    (Is there a rectangular thermal pad too?)


    It is confirmation about TPS3852-Q1.

    The TPS3852-Q1 datasheet does not contain information on the dimensions and shape of the thermalpad.
    ("THERMAL PAD SIZE AND SHAPE ON SEPARATE SHEET" is stated on page 29 of the datasheet, but there is no such separate sheet.)
    Also, the land pattern information is not described.

    Q3.
    On page 30 of the TPS3852 datasheet, thermalpad dimensions and shapes are described.
    Is TPS3852-Q1 the same as this?

    Q4.
    On page 30 of the TPS3852 datasheet, LAND PATTERN DATA are described.
    Is TPS3852-Q1 the same as this?

    Q5.
    > We do not provide the chamfer specifications for this device.
    > If we don't provide dimensions of the chamfer, then you can use a simple rectangle shape rather than a shape with chamfer.

    From the above answer, I understood that the thermalpad shape of TPS3852-Q1 is a rectangle.
    (That is, there is no chamfer.)

    Is it correct?


    *
    I am referring to the following datasheet.

    TPS3850-Q1 :SBVS264A
    TPS3850 :SBVS301A
    TPS3852-Q1 :SBVS285
    TPS3852 :SBVS302

    -Harukawa

  • 0 in reply to Michael_DeSando
    TI__Prodigy 50 points

    Sorry but let me junp in. About A1, TPS3850-Q1 comes with wettable flanks while TPS3850 doesn not. Do you mean that thermal pad info is still identical for both devices? Regards, Hiroyuki Ohde

  • 0 in reply to Hiroyuki Ohde
    TI__Genius 12630 points
    Hiroyuki Ohde,

    I could not find anything that suggests the thermal pad dimensions are different between TPS3850 and TPS3850Q1. The wettable flanks should not significantly change the thermal pad dimensions especially since the dimensions provided in the package information for both datasheets is the same.

    -Michael
  • 0 in reply to Noritomo Harukawa
    TI__Genius 12630 points
    Harukawa-san,

    A1. Both pages are correct and have the same dimensions labeled. The pages show different amount of detail and different orientations but describe the same package.

    A2. The chamer is optional because it is used to only describe pin 1 location. During layout, you can use a rectangle shape when creating a pad on the board. The devices come with a chamer thermal pad. The dimensions of the chamer are not important. The rectangular dimensions are the only dimensions you need for layout.

    A3. Yes, TPS3852 and TPS3852-Q1 are the same package and same thermal pad dimensions.

    A4. Yes, the land patterns are also the same for TPS3852 and TPS3852-Q1.

    A5. There is a chamfer but only to describe pin 1 location. Use a rectangle shape pad for the layout. See the layout guidelines provided in the datasheets. It is not necessary to replicate the chamfer on the board during layout.

    I hope this response helps you! Let me know if you have any more questions or need any clarification. Thank you!

    -Michael