I have a question.
I checked datasheet on 28page.
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I have a question.
I checked datasheet on 28page.
Hello Ozawa,
I do not see any figure, but the land pattern given shows to make the thermal pad large enough for tolerances, so it should be 1.83mm x 1.89mm.
Regards,
Clint
Hello Ozawa-san,
That dimension should be 1.89mm. It actually has the pad dimensions in the datasheet a page or two after that picture.
Regards,
Clint
Hello Ozawa,
I cannot see any pictures attached, they are just little "x"s. In any case yes, those are the dimensions of the solder mask opening. See the datasheet section near the end titled "Thermal Pad Mechanical Data".
Regards,
Clint
Hello Ozawa,
The measurements on page 28 refer to the DAP of the IC with tolerances (min/max).
The measurements on page 29 are for the PCB land pattern which is the max DAP dimension in each direction so that all devices will solder down correctly.
I hope that explains the difference.
Regards,
Clint