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LM5118: LM5118MHX/NOPB

Shlomi Yehezkia
Mastermind 6150 points
Part Number: LM5118

Hi Team,

Attached my questions, please help.

Thanks,

Shlomi

LM5118MHX.docx

  • 0
    TI__Guru* 78440 points
    Hi Shlomi,

    Thank you for you interests in the LM5118. Actually those questions are for your manufacturing engineers. I don't think TI has a special requirment for the solder paste thickness other than the regular manufacturing procedure. The solder paste is actually determined by thickness of the stencil which you would use. You need to check all your parts on the board to choose a proper stencil thickness.

    To clarify, the spacing between the IC body and the PCB floor (without solder) is 0.1mm with 0.05mm tolerance. For pin pitch of about 0.5mm, the regular stencil is about 5mil or about 0.12 ~0.13mm. The LM5118' pin pitch is slightly greater than 0.5mm, you may use a slightly thicker stencil if it does not violate other parts' dimension.

    Thanks,
    Youhao Xi, Applications Engineering