LMZM33606: Complression limits for LMZM33606 under an heat sink

Efraim Brandolini

Part Number: LMZM33606

Dear all,

I need to use a thermal pad on the top of a LMZM33606 in order connect it to a heat sink and remove as much heat as possible.

Can you tell me what's the compression resistance of this device once mounted on a PCB?

Because I cannot use thermal paste and thermal pads require mounting pressures between 10 and 40 PSI in order to reach good performances. This means that I will compress the power module with a total force between 12 N and 45 N. Im not aware of the common mechanical resistance of such a device.

Thanks and kind regards,

Efraim Brandolini

over 5 years ago

0 Jimmy Hua over 5 years ago

TI__Guru 50120 points

Hi Efraim,

I have contacted a product reliability engineer to get their take/expertise on this subject matter. I hope to provide you with an update by the end of this week or at the earliest I get information back.

Thank you for your patience.

Regards,

Jimmy

0 Efraim Brandolini over 5 years ago in reply to Jimmy Hua

Prodigy 50 points

Thankyou Jimmi for your fast reply,

Efraim

0 Efraim Brandolini over 5 years ago in reply to Jimmy Hua

Prodigy 50 points

Hi Jimmy,

any news from the engineers ?

Thankyou,

Efraim

0 Jimmy Hua over 5 years ago in reply to Efraim Brandolini

TI__Guru 50120 points

Hi Efraim,

I have not heard back from the engineer. I will ping him again and try to get an answer by EOB today.

Regards,

Jimmy

0 Jimmy Hua over 5 years ago in reply to Jimmy Hua

TI__Guru 50120 points

Hi Efraim,

To my knowledge, there is no specific characterization of this for any of the power modules and or converters for the matter.

Unless I get information from the product engineer, I would go with the assumption that there are no parameter to quantify the compression limit.

Regards,

Jimmy

Power management

Power management forum

LMZM33606: Complression limits for LMZM33606 under an heat sink